CHILL BOND 8111 – Thixotropic Epoxy Adhesive


CHILL BOND 8111 ™  Thixotropic Epoxy Adhesive is a 100% solid and a very reactive two component epoxy adhesive. The component mixture will form a very highly thixotropic paste with a medium exothermic reaction. CHILL BOND 8111™ can be applied on horizontal or vertical surfaces up to 1/16 of an inch thick. It can be used to structurally bond most rigid substrates such as wood, concrete, metal and some
thermosetting plastic. Ideal to bond wooden and metal parts in the woodworking industry.

The advantage of the CHILL BOND 8111™ compared to common one-part PVA wood adhesive is that it will fill any gaps and resist to a myriad of chemical products. CHILL BOND 8111™ will reach an approximate 80% of its strength within 24 hours at 22°C so the parts can easily be manipulated.

Product Features:

• Easy to mix, (1:1 Ratio)
• Impact resistant
• Easy to apply
• High bond strength
• Non-sagging
• Highly thixotropic
• Low shrinkage
• Can be pigmented with the CHILL DROPS™ PIGMENTS

Product characteristiques:

  • Easy Mixing Ratio: 1:1 by volume or 100/87 by weight
  • Ideal Working Temperature: 22C /72F
  • Mixing time: 5 minutes minimum until color is uniform
  • Pot Time: 30 minutes at 22C/72F  depending on volumes and room temperature
  • Cure Time: 24-36h depending on volume, room temperature, humidity level, and thickness
  • Recommended Thickness per Layer: up to 1/16 of an inch thick
  • Consistency : Thixotropic Gel
  • Recommended cleaning products: POLY CLEANER™  Resin Cleaner


In stock

SKU: CHILLBOND8111-KIT-2L Category:


APPLICATIONS. All surfaces must be intact, hard, dry and free form grease, oil, dust, oxidation or other contaminants that can prevent proper adhesion. Mix equal part of A and B by volume until color is uniform. Use a metal spatula to mix both parts together to reach total homogeneity. Scrape the bottom and sides on the container to assure that both parts are directed to the center of the mass. To ensure good results on the assembly, make sure adhesive fills all gaps between substrates being bonded. Secure the assemblies with clamps if required. Uncured components can easily be cleaned by using the POLY CLEANER™. Please consult POLYMERES TECHNOLOGIES for more details based on your application. IMPORTANT: we strongly recommend to validate your techniques before going on production. the success of your assembly to reach a structural bonding are the followings: • precise ratio in weight or volume. • homogeneous mix of the parts a/b in using an appropriate mixing tool and time of mixing. • surface preparation of the parts to be assembled. • the assemblies must remain at 22°c for the total period of polymerization.

Additional information

Weight 2.26 kg
Dimensions 17.78 × 17.78 × 25.4 cm


You may also like…